What is hb-100 EF series of additives for improving etching factor?
Hb-ef series is to produce better etching performance in CuCl2. The addition of hb-ef series is helpful to improve the etching coefficient and maximum yield.
advantage
• Easy to use in production line
• Maintain available concentration and improve management convenience
• It is not limited by the concentration of hydrochloric acid (0.5N ~ 1.5n), but suitable for a wide range.
• PCB size can be miniaturized
• Maximum yield of etching Engineering
- Maximum width of upper end: ensure to increase circuit width more than 10 ㎛ in 80pitch products
- Increase of cross-sectional area of Conductor: more than 10% increase shall be ensured
- Improve the electrical characteristics: reduce the resistance / thermal resistance by more than 10%, reduce / allow the electric flow to increase / reduce noise, etc.
compare
2oz, L / S / P = 75 / 75 / 150 actual circuit section of product (PC main board)
experimental result
HB-120EF
Thickness of copper 20~35μm ; SSD module, PC Memory module, Mobile application
Thickness of copper < 20μm ; BGA, Flipchip Package, FPCB
Thickness of copper 15μm One set of products
HB-100EF
Thickness of copper 50μm Above network, communication products
